PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain sensors (f/m/div.)
27.11.2024
Bosch-Gruppe
Reutlingen
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PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain sensors (f/m/div.)
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Reutlingen
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PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain sensors (f/m/div.)
Reutlingen
Aktualität: 27.11.2024
Anzeigeninhalt:
27.11.2024, Bosch-Gruppe
Reutlingen
PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain sensors (f/m/div.)
Aufgaben:
The aim is to create sensors capable of mapping the strain and stress induced on packages by environmental conditions such as temperature changes or physical bending.
These conditions may arise from processes such as the soldering of the package to the Printed Circuit Board (PCB) or during the temperature cycles of the soldering process.
The project involves extensive research and development work, including design, simulation, fabrication, and testing of the MEMS strain sensors.
Qualifikationen:
You have a master's degree with excellent grades in a suitable field such as Microsystems, Electrical Engineering, Mechanical Engineering, Physics, Material Science, or a related field
You have a strong background in MEMS technology and FEM simulations.
You have experience working with different domains (e.g. simulation, technology and testing).
Good English communication skills, both written and verbal, are required.
Berufsfeld
Bundesland
Standorte